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1·The process of flip chip based on aluminum nitride is studied.

研究了以氮化铝为基板的倒扣封装的工艺。

2·The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。

3·The embedded active chip also can be realized by backside thinning and flip chip bonding.

通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。

4·Flip chip technology has become one of the major joining technologies in electronic packaging.

摘要覆晶技术已成为电子构装中之主要接合技术之一。

5·Flip chip technology has become one of the major joining technologies in electronic packaging.

覆晶技术已成为电子构装中之主要接合技术之一。

6·Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。

7·The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.

该系统可以处理直径多达200毫米的晶片，包括模具的倒装。

8·This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。

9·This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.

本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。

10·Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。