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1·Set up ultrasonic wire bonding laboratory.

成立超声波电子焊接实验室。

2·Wire bonding is a critical technique for realizing microwave hybrid circuit.

引线键合是实现微波混合电路的关键技术。

3·The first step is to model the close loop control system of wire bonding force.

两步走的策略被采用：第一步，建立键合力控制系统的闭环模型；

4·That BP network used for predicting quality of wire bonding is feasible and valid.

BP网络用于金丝键合质量的预报具有可行性和有效性。

5·A correlative performance experimental of wire bonding positioning table is tested.

对引线键合定位平台进行了相关实验，对平台进行了性能测试。

6·Wire bonding is still the most popular interconnect technology in the first-level packaging.

一级封装中最流行的互连技术仍为丝焊。

7·Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.

丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。

8·This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.

本研究的目的是评估单晶铜引线接合的接合性和可靠性。

9·The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.

纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。

10·Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.

气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。