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1·The characteristics of bonding force in the ultrasonic bonding process were also studied.

在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。

2·Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.

粗铝丝超声引线键合；换能器驱动电流；信号时频分析；特征提取；质量在线监测。

3·According to the circuit of ultrasonic wire bonding experiment platform, a piezoelectric transducer (PZT) driver signal acquisition circuit was designed.

根据超声引线键合实验平台电路结构，设计了PZT(压电陶瓷)驱动信号采集电路。

4·In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.

在超声引线键合过程中，键合力是影响键合强度的重要因素之一。

5·The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。

6·The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.

试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。

7·Thermal-structural analysis was performed for ultrasonic wire bonding(UWB) by three dimensional finite element method(FEM).

用三维有限元方法对超声波线焊进行了瞬态的热-结构分析。

8·A low frequency ultrasonic Lamb like wave method suitable for characterizing the thickness, density, shear and longitudinal wave velocities of the ultra thin bonding composite is presented.

提出用低频超声类兰姆波定征方法来估计超薄黏结复合结构各层与黏结层的厚度、密度、纵波声速和横波声速等参数。

9·The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.

超声功率是影响粗铝丝引线键合强度的最主要因素之一。

10·Based on the experimental results, the models of the ultrasonic wedge bonding process and the interfacial bonding characteristics were illustrated.

给出了超声楔形键合接合过程和界面特征的模型。