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1·The epoxy molding compounds (EMC) was prepared by hot pressing molding method.

采用热模压法制备了环氧模塑料（EMC）。

2·The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.

本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。

3·Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.

对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。

4·Plastics industry — All kinds of plastic molding particles made from phenol, urea, melamine, and epoxy.

塑料工业中的苯酚、尿素、密胺、环氧树脂等各种塑料成型的颗粒。

5·Plastics industry - All kinds of plastic molding particles made from phenol, urea, melamine, and epoxy.

塑料工业中的苯酚、尿素、密胺、环氧树脂等各种塑料成型的颗粒。

6·The influence of particle size, content of epoxy adhesives, molding pressure and aligning field on the properties of bonded magnets is investigated.

考察了粉末粒度、粘结剂含量、成型压力、磁场等对粘结磁体性能的影响。

7·Contacts box for epoxy resin APG pressure molding process gel structure, used for various handcart type switch cabinet, the insulation isolation and connection function transition.

触头盒为环氧树脂apg工艺压力凝胶成型结构，用于各种手车式开关柜，起绝缘隔离和联接过渡作用。

8·Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;

研究了玻璃粉／环氧树脂封接复合材料的制备与性能。