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1·Hybrid circuit fabrication and repair.

混合电路制造和修理。

2·Wire bonding is a critical technique for realizing microwave hybrid circuit.

引线键合是实现微波混合电路的关键技术。

3·The design of h. CLID has been simplified in comparison to hybrid circuit breaker that has to perform both making and breaking function.

和可实现接通和分断功能的混合断路器相比，H—CLID的设计却简化多了。

4·Themicrostrip—lumped hybrid circuit is applied. This amplifier has compact structure, small size, stable performance and convenient tuning.

该放大器采用微带和集中参数混合电路形式，具有体积小，结构紧凑，调试方便，性能稳定的特点。

5·Hybrid circuit breaker (HCB) combining the advantages of mechanical circuit breaker and solid state circuit breaker is new research direction in the world for circuit breaker.

混合式断路器(HCB)结合了机械式断路器和固态断路器的优点，是国际上断路器研究的新方向。

6·Its floating output is referenced to a floating rail with offset capability up to 500V. The hybrid circuit designed to drive MOS-gated devices is more effective and lower cost thanIR2110.

设计了一种厚膜驱动电路，除与IR2110的基本功能相同以外，还具有简单、经济、实用的特点。

7·The hybrid system integrates organic and metal parts within a single electrical circuit. A big hats off to the whole on off team from d-Vision.

该混合动力系统集成了有机及金属配件在一个单独电路，一个大的帽子盖住了整个来自d - Vision的团队。

8·This article mainly introduces applications of X - ray technology in the fields of hybrid integrated circuit failure analysis, DPA, and screening test.

本文主要介绍X射线透视技术在混合集成电路的失效分析、DPA以及筛选领域中的应用。

9·Present paper introduces the structure of hybrid contactor, triggering circuit and its protector.

本文介绍混合式接触器的结构、触发电路及其保护器。

10·Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.

将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。