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1·Wet chemical etching of sacrificial layers plays an important part in fabricating movable tree-dimensional micromachines by combination with MEMS technologies.

牺牲层腐蚀技术结合MEMS技术是制作三维可动微机构的一个重要加工手段。

2·This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.

本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。