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1·Including optical analyzer, salt spray test machine, infrared reflow soldering, constant temperature oven, current load, etc.

当中包括光普分析仪、盐雾测试机、红外线回流焊、恒温炉、电流负载等设备。

2·Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.

此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。

3·Compatible with infrared and vapor phase reflow solder process.

红外线和汽相回流焊工艺兼容。