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1·Chemical Mechanical Polishing(CMP); abrasive particle; modeling; wafer;

机械化学抛光； 磨粒； 建模； 芯片；

2·At least a part of the abrasive particles are arranged in the form of abrasive particle groups.

至少一部分磨蚀颗粒布置成磨蚀颗粒组的形式。

3·The study showed that when length of circular column part is 2.5 ~ 3.0 times outlet diameter, abrasive particle velocity near to 95% velocity of water-jet.

研究表明，当喷嘴的圆柱段长度是喷嘴出口直径的2 5 ~ 3 0倍时，粒子的速度能达到水射流速度的95%。

4·Polishing and grinding the same way, the difference is polishing the abrasive particle size used to be much thinner than the grinding, polishing speed is also large.

抛光加工与磨削加工方式基本相同，所不同之处是抛光加工所采用的磨料粒度比磨削要细得多，抛光速度也大。

5·Cup wheel is investigated in this paper which includes cutting model of abrasive particle, computer model of face grinding and optimization of technological parameters etc.

本文包括杯形砂轮的磨粒切削模型、计算机模型，以及工艺参数的优化研究等内容。

6·When WC content is more then 50%, spray-fusing technological property becomes worse, hardness of sprayed coating and low-stress abrasive particle wear resistance are weaken.

当w（WC）大于50%时，WC的加入使喷熔工艺性能变得极差，喷熔层的硬度和耐低应力磨粒磨损性能降低。

7·The invention provides the abrasive particle strobe photographic equipment which can observe the distribution state of abrasive particles and facilitate test operation and processing.

本发明提供一种能够观察磨粒的分布状态、便于试验操作和处理的磨粒频闪摄影装置。

8·In the low wearing area of the loose abrasive of tiny particle, wear mechanism is mainly the micro-cuts wearing mechanism, and the surface has obvious furrow and indentation.

在小颗粒松散磨料的低磨损区，磨损机理主要是微观切削磨损机理，表面有明显的犁沟或者印痕。

9·The sizes of filler and abrasive have influence on the solid particle erosion of coating under the given condition, the size of filler be of weak influence on the slurry erosion.

填料粒度和磨料粒度都对涂层的气固冲蚀磨损有影响，但在给定的试验条件下，填料粒度对涂层的浆体冲蚀磨损影响甚微。

10·Solide carbide alioy matrix of super fine particle. Combined the abrasive resistance and cutting blade intensity of the cutting perfectly.

极细颗粒的硬质合金基体，使刀具的耐磨性和切削刃强度得到完美结合。