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1·Especially, the principles of glass passivation on silicon devices and processes are described.

特别论述硅器件玻璃钝化的原理和工艺流程。

2·A new method of mesa making model is proposed, and a new way of glass passivation technique is applied to high voltage and big current thyristor.

提出了台面造型的新方法，实现了在大台面、高电压、大电流晶闸管上采用玻璃钝化技术新的工艺途径。

3·The non-parasitic parameter carrier is superior to the quartz carrier and beam-lead carrier as well as glass passivation carrier in either performance or strength.

与石英载体，梁式引线载体以及玻璃钝化载体相比，不论在性能上或者强度上都具有明显的优点。