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1·Solder side is chosen to measure.

量测以吃锡面为选择点。

2·In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.

采用这种技术时，电路板的元件侧专用于接地层，信号走线则布设在焊接侧。

3·If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.

如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。

4·Now press the hot iron firmly against the splice while letting the free end of your solder rest against the other side of the joint.

现在，紧按住电烙铁顶压在接头上，同时让余下的锡焊料的“空闲”的未端去接触接头的另一侧。

5·Special design modifications will result in more heat in the solder barrel and will guide the solder to the solder destination side of the board.

特别的改造设计会促成更多的热能留在通孔里从而导致焊锡往电路板上的焊接方向流去。

6·The guard must be symmetrical and centered on the blade (side to side). Solder fittings shall be clean and appealing, free from lumps, holes, or voids.

护手必须以刀为中心对称，焊接装配干净美观，没有结块，洞眼或空隙。