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1·In this paper, an automatic wire bonder is presented.

本文介绍了一台自动引线键合装置。

2·Its accuracy will influence the accuracy of LED die bonder.

其精度直接影响到LED粘片的精度。

3·The key parts of thick-film LED bonder system are control system and visual position system.

粘片机系统中的主要部分是控制系统和视觉定位系统。

4·Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。

5·Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.

最后从属焊接机基于正确的焊接位置附上连接粘合剂。

6·Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。

7·At the same time, the hardware system and software system of automatic bonder are specifically designed.

同时具体设计了自动焊机的硬件系统和软件系统。

8·Used functional magnetic pulse therapy treatment, and treatment with Bonder Line there is a clear distinction.

采用磁疗脉冲治疗功能治疗时，与带线粘片治疗有著明显的区别。

9·At present, the algorithm has been applied to the image matching system of the fully automatic gold wire bonder.

目前，该算法已在全自动金丝球焊机的图像识别系统中得到实际应用。

10·The sheet is then passed through a thermal bonder (290) to thermally bond the reinforcement glass fibers and resin.

然后使片材通过热粘合机(290)，以便热粘合增强玻璃纤维和树脂纤维。

(1)die bonder芯片焊接机；模片结合器，裸片结合器

(1)wire bonder引线接合器；丝焊器