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1·It has isotropic properties and low warpage.

它各向同性性能和低翘曲。

2·It has improved impact resistance and low warpage.

它改善了耐冲击性和低翘曲。

3·Next, inspect the gusset for warpage and straighten as needed.

下一步，检查和整顿的翘曲扣板根据需要的一面。

4·Adjusting delay time and gas pressure can reduce the warpage of the part.

工艺上可以通过调整延迟时间和气体压力来减小产品的变形量。

5·Thickening the wall will help reduce orientation related warpage problems.

增加壁厚将有助于减少因取向引起的翘曲问题。

6·The speckle projection correlation technique is used to measure the chip warpage.

本文采用投影散斑相关法对芯片翘曲度进行了测量。

7·A warpage analysis provides answers to questions such as: will the moulding distort?

变形分析可以对我们的难题进行解决，如：这个产品是否存在扭曲变形？

8·It has improved surface aesthetics, excellent dimensional stability and low warpage characteristics.

它改进表面美观，良好的尺寸稳定性和低翘曲的特点。

9·Moreover, fast filling and less time for holding were also dedicated to reduce the warpage of product…

适当提高注射速率和减少保压时间也可减小制品翘曲。

10·An even cooling design becomes very important to control the shrinkage and warpage at an acceptable level.

为了将收缩弯翘控制在可以接受的程度，均衡的冷却设计变得非常重要。

翘曲

1·The principle of precompensation for deformation was presented, which was applied to the shaping of an automobile fan and effectively helped lower the shrinkage deformation and warpage of the product.

介绍了变形预补偿的原理，以汽车风扇为例，成功地降低了汽车风扇的收缩变形和翘曲变形，为解决制品变形问题提供了一条新的思路。

2·All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.

所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。

3·The impact of temperature dependent material property on the warpage of composite shell segment was discussed.

研究了温度敏感性对复合材料开口圆柱层压壳热翘曲变形影响。

4·Base on the nonlinear large analysis, warpage of matrix SDBGA during the whole assembly processes are predicted.

文中基于非线性特性分析、预测了在整个集成工艺中SDBGA阵列的翘曲。

5·It has improved impact resistance and low warpage.

它改善了耐冲击性和低翘曲。