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1·Chemical Mechanical Polishing(CMP); abrasive particle; modeling; wafer;

机械化学抛光； 磨粒； 建模； 芯片；

2·Polishing pad is a very important component of the chemical-mechanical polishing (CMP) system.

抛光垫是化学机械抛光(CMP)系统的重要组成部分。

3·Polishing pad conditioning is very important for chemical mechanical polishing to improve the performances of a pad.

抛光垫修整是化学机械抛光的重要过程之一。

4·The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.

对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。

5·Embarked from the component and structure of phosphate laser glass, its chemical-mechanical polishing (CMP) mechanism is analyzed.

从磷酸盐激光玻璃的成分和结构出发，分析了其化学机械抛光(CMP)机制。

6·A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (a) a styrene polymer and (b) a diene polymer.

一种化学机械抛光垫，包含由(A)苯乙烯聚合物和(B)二烯聚合物构成的非水溶性基质。

7·The invention further provides methods of polishing a substrate using each of the above-described chemical-mechanical polishing compositions.

本发明进一步提供一种使用上述各化学机械抛光组合物抛光基材的方法。

8·Single stage re-circulation filtrations were performed to remove oversized particles from colloidal silica based Chemical-Mechanical Polishing (CMP) slurry.

单步循环过滤，用来去除胶体硅基化学机械抛光(CMP)磨料中尺寸过大的微粒。

9·In Chemical-Mechanical polishing experiments we produced optical quality super smooth surfaces on single-crystal silicon, but cannot insure the surface figure.

使用机械 -化学抛光法加工大尺寸单晶硅可获超光滑表面 ，但很难保证良好的面型。

10·The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.

探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。